APA引文

Tang, S., Guo, T., Cheng, L., & ENGINEERING, M. (2014). Rate dependent interface delamination in plastic IC packages.

Chicago Style Citation

Tang, S., T.F Guo, L. Cheng, and MECHANICAL ENGINEERING. Rate Dependent Interface Delamination in Plastic IC Packages. 2014.

MLA引文

Tang, S., T.F Guo, L. Cheng, and MECHANICAL ENGINEERING. Rate Dependent Interface Delamination in Plastic IC Packages. 2014.

警告：這些引文格式不一定是100％准確.