APA Citation

Tang, S., Guo, T., Cheng, L., & ENGINEERING, M. (2014). Rate dependent interface delamination in plastic IC packages.

Chicago Style Citation

Tang, S., T.F Guo, L. Cheng, and MECHANICAL ENGINEERING. Rate Dependent Interface Delamination in Plastic IC Packages. 2014.

MLA Citation

Tang, S., T.F Guo, L. Cheng, and MECHANICAL ENGINEERING. Rate Dependent Interface Delamination in Plastic IC Packages. 2014.

Warning: These citations may not always be 100% accurate.