APA Citation

Xiong, Z., Tay, A., & ENGINEERING, M. &. P. (2014). Modeling of viscoelastic effects on interfacial delamination in IC packages.

Chicago Style Citation

Xiong, Z., A.A.O Tay, and MECHANICAL & PRODUCTION ENGINEERING. Modeling of Viscoelastic Effects On Interfacial Delamination in IC Packages. 2014.

MLA Citation

Xiong, Z., A.A.O Tay, and MECHANICAL & PRODUCTION ENGINEERING. Modeling of Viscoelastic Effects On Interfacial Delamination in IC Packages. 2014.

Warning: These citations may not always be 100% accurate.