Chua, H., Pey, K., Lai, W., Siah, S., & ENGINEERING, E. (2014). Formation of voids in Ti-salicided BF+ 2-doped submicron polysilicon lines.
Chicago Style CitationChua, H.N., K.L Pey, W.H Lai, S.Y Siah, and ELECTRICAL ENGINEERING. Formation of Voids in Ti-salicided BF+ 2-doped Submicron Polysilicon Lines. 2014.
MLA CitationChua, H.N., et al. Formation of Voids in Ti-salicided BF+ 2-doped Submicron Polysilicon Lines. 2014.
Warning: These citations may not always be 100% accurate.