APA引文

Wang, G., Jong, Y., Balakumar, S., Seah, C., Hara, T., & ENGINEERING, E. &. C. (2014). Enhancement of adhesion strength of Cu seed layer with different thickness in Cu/low-k multilevel interconnects.

Chicago Style Citation

Wang, G., Y.W Jong, S. Balakumar, C.H Seah, T. Hara, and ELECTRICAL & COMPUTER ENGINEERING. Enhancement of Adhesion Strength of Cu Seed Layer With Different Thickness in Cu/low-k Multilevel Interconnects. 2014.

MLA引文

Wang, G., et al. Enhancement of Adhesion Strength of Cu Seed Layer With Different Thickness in Cu/low-k Multilevel Interconnects. 2014.