Bed of nails - 100-μm-pitch wafer-level interconnections process
10.1109/TEPM.2008.2004500
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Main Authors: | Vempati, S.R., Tay, A.A.O., Kripesh, V., Yoon, S.W. |
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Other Authors: | MECHANICAL ENGINEERING |
Format: | Article |
Published: |
2014
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Subjects: | |
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/84883 |
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Institution: | National University of Singapore |
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