APA引文

Tay, A., Zhu, H., & ENGINEERING, M. (2014). A numerical study of the effect of die, die pad and die attach thicknesses on thin plastic packages.

Chicago Style Citation

Tay, A.A.O., H. Zhu, and MECHANICAL ENGINEERING. A Numerical Study of the Effect of Die, Die Pad and Die Attach Thicknesses On Thin Plastic Packages. 2014.

MLA引文

Tay, A.A.O., H. Zhu, and MECHANICAL ENGINEERING. A Numerical Study of the Effect of Die, Die Pad and Die Attach Thicknesses On Thin Plastic Packages. 2014.