Tay, A., Zhu, H., & ENGINEERING, M. (2014). A numerical study of the effect of die, die pad and die attach thicknesses on thin plastic packages.
استشهاد بنمط شيكاغوTay, A.A.O., H. Zhu, و MECHANICAL ENGINEERING. A Numerical Study of the Effect of Die, Die Pad and Die Attach Thicknesses On Thin Plastic Packages. 2014.
MLA استشهادTay, A.A.O., H. Zhu, و MECHANICAL ENGINEERING. A Numerical Study of the Effect of Die, Die Pad and Die Attach Thicknesses On Thin Plastic Packages. 2014.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.