APA Citation

Su, Y., Tan, L., Tan, V., Tee, T., & ENGINEERING, M. (2014). Rate-dependent properties of Sn-Ag-Cu based lead free solder joints.

Chicago Style Citation

Su, Y., L.B Tan, V.B.C Tan, T.Y Tee, and MECHANICAL ENGINEERING. Rate-dependent Properties of Sn-Ag-Cu Based Lead Free Solder Joints. 2014.

MLA Citation

Su, Y., et al. Rate-dependent Properties of Sn-Ag-Cu Based Lead Free Solder Joints. 2014.

Warning: These citations may not always be 100% accurate.