發送短信 : Study of diffusion barrier properties of ionized metal plasma (IMP) deposited tantalum (Ta) between Cu and SiO2

 _    _      ___               __   __    ______  
| |  | ||   / _ \\      ___    \ \\/ //  /_   _// 
| |/\| ||  | / \ ||    /   ||   \ ` //   `-| |,-  
|  /\  ||  | \_/ ||   | [] ||    | ||      | ||   
|_// \_||   \___//     \__ ||    |_||      |_||   
`-`   `-`   `---`       -|_||    `-`'      `-`'   
                         `-`