CHAN, D. (2012). How are the chips stacked in interim relief applications? Institutional Knowledge at Singapore Management University.
استشهاد بنمط شيكاغوCHAN, Darius. How Are the Chips Stacked in Interim Relief Applications? Institutional Knowledge at Singapore Management University, 2012.
MLA استشهادCHAN, Darius. How Are the Chips Stacked in Interim Relief Applications? Institutional Knowledge at Singapore Management University, 2012.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.