Space-Charge-Limited Dark Injection (SCL DI) transient measurements

by Yap B.K., Koh S.P., Tiong S.K., Ong C.N.
Published 2023

Solder ball robustness study on polymer core solder balls for BGA packages

by Kar Y.B., Hui T.C., Agileswari, Lo C.
Published 2023

Comparison study on reliability performance for polymer core solder balls under multiple reflow and HTS stress tests

by Kar Y.B., Hui T.C., Agileswari R., Lo C.
Published 2023

Comparison study on shear strength and intermetallic compound for SAC and polymer core solder balls

by Kar Y.B., Agileswari, Hui T.C., Talik N.A.
Published 2023

Thermal stress test for PLED

by Yap B.K., Koh S.P., Tiong S.K., Ong C.N.
Published 2023

Electrical stability of PLEDs

by Kar Y.B., Bradley D.
Published 2023

Charge transport of novel blue dibenzothiophene phenylenediamine copolymer

by Kar Y.B., Abdullah S.F., Chou Y.T., Kok H.C.
Published 2023

Potential point-of-care microfluidic devices to diagnose iron deficiency anemia

by Yap B.K., Soair S.N.M., Talik N.A., Lim W.F., Lai Mei I.
Published 2023

Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS

by Kar Y.B., Talik N.A., Sauli Z., Fei J.S., Retnasamy V.
Published 2023

Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology

by Kar Y.B., Talik N.A., Sauli Z., Seng F.C., Yong T.C., Retnasamy V.
Published 2023

Recent advances of In2O3-based thin-film transistors: A review

by Yap B.K., Zhang Z., Thien G.S.H., Chan K.-Y., Tan C.Y.
Published 2024