Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology

• Main Authors: Kar Y.B., Talik N.A., Sauli Z., Seng F.C., Yong T.C., Retnasamy V.
• Other Authors: 26649255900
• Format: Article
• Published: 2023
• Subjects: Contamination; Decontamination; Flip chip; Flux cleaning; Ionic contaminations; Solvents; Water-based solvent; Chromatographic analysis; Contamination levels; Design/methodology/approach; Environmental-friendly; Flip chip ball grid array; Ionic contamination; Long term performance; Water based
• Institution: Universiti Tenaga Nasional

Purpose - This paper aims to discuss the effects of ionic contaminations on the die surface of high lead flip chip ball grid array (FCBGA) package. Ionic contaminations from the flux residue, formed during the die attachment process, could affect the package long-term performance. Design/methodology...