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A., Ourdjini
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A., Ourdjini
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Effect of solder bump size on interfacial reactions during soldering between Pb-free solder and Cu and Ni/Pd/Au surface finishes
by
F., Nor Akmal
,
A
.,
Ourdjini
,
M. A., Azmah Hanim
,
I., Siti Aisha
,
Y. T., Chin
Published 2007
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