Wafer level packaging of pressure sensor using SU8 photoresist

by Iliescu, C., Tay, F.E.H., Miao, J., Avram, M.
Published 2014

Theoretical analysis and experiment of a novel dep chip with 3-D silicon electrodes

by Yu, L., Tay, F.E.H., Xu, G., Ilscu, C., Avram, M.
Published 2014

Two masks process for high aspect ratio inertial sensors with ajustable range

by Iliescu, C., Avram, M., Miao, J., Tay, F.E.H., Xu, G.
Published 2014

A new fabrication process of silicon nanotips - NERCOM

by Tay, F.E.H., Iliescu, C., Xu, G., Chen, B., Avram, M.
Published 2014

Adhesive bonding with SU-8 at wafer level for microfluidic devices

by Yu, L., Tay, F.E.H., Xu, G., Chen, B., Avram, M., Iliescu, C.
Published 2014