Wafer level packaging of pressure sensor using SU8 photoresist

Wafer level packaging of pressure sensor using SU8 photoresist

10.1117/12.582235

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Bibliographic Details
Main Authors: Iliescu, C., Tay, F.E.H., Miao, J., Avram, M.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Subjects:
Pressure sensor
SU8
Wafer level packaging
Wafer-to-wafer bonding
Online Access:http://scholarbank.nus.edu.sg/handle/10635/74011
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/74011

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