Characterization of intermediate In/Ag layers of low temperature fluxless solder based wafer bonding for MEMS packaging

Characterization of intermediate In/Ag layers of low temperature fluxless solder based wafer bonding for MEMS packaging

10.1016/j.sna.2008.10.011

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Bibliographic Details
Main Authors: Lee, C., Yu, A., Yan, L., Wang, H., He, J.H., Zhang, Q.X., Lau, J.H.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Article
Published: 2014
Subjects:
Fluxless
Indium
MEMS
Solder
Wafer bonding
Wafer level packaging
Online Access:http://scholarbank.nus.edu.sg/handle/10635/82043
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/82043

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