Development of stretch solder interconnections for wafer level packaging

Development of stretch solder interconnections for wafer level packaging

10.1109/TADVP.2008.923390

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Bibliographic Details
Main Authors: Rajoo, R., Lim, S.S., Wong, E.H., Hnin, W.Y., Seah, S.K.W., Tay, A.A.O., Iyer, M., Tummala, R.R.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Hourglass interconnect
Solder joint reliability
Stretch solder interconnect
Temperature cycling
Wafer level packaging
Online Access:http://scholarbank.nus.edu.sg/handle/10635/59946
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Institution: National University of Singapore

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http://scholarbank.nus.edu.sg/handle/10635/59946

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