Development of stretch solder interconnections for wafer level packaging

• Main Authors: Rajoo, R., Lim, S.S., Wong, E.H., Hnin, W.Y., Seah, S.K.W., Tay, A.A.O., Iyer, M., Tummala, R.R.
• Other Authors: MECHANICAL ENGINEERING
• Format: Article
• Published: 2014
• Subjects: Hourglass interconnect; Solder joint reliability; Stretch solder interconnect; Temperature cycling; Wafer level packaging
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/59946
• Institution: National University of Singapore

10.1109/TADVP.2008.923390