Study of Ag-In solder as low temperature wafer bonding intermediate layer

10.1117/12.762046

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Bibliographic Details
Main Authors: Made, R.I., Gan, C.L., Lee, C., Yan, L.L., Yu, A., Yoon, S.W., Lau, J.H.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Subjects:
Ag
In
Online Access:http://scholarbank.nus.edu.sg/handle/10635/84245
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Institution: National University of Singapore