Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications
10.1007/s11664-008-0555-8
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| Main Authors: | , , , , , , |
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| Other Authors: | |
| Format: | Article |
| Published: |
2014
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| Subjects: | |
| Online Access: | http://scholarbank.nus.edu.sg/handle/10635/83103 |
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| Institution: | National University of Singapore |