Development of wafer level packaged scanning micromirrors

Development of wafer level packaged scanning micromirrors

10.1117/12.762021

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Bibliographic Details
Main Authors: Yu, A., Lee, C., Yan, L.L., Zhang, Q.X., Yoon, S.U., Lau, J.H.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Article
Published: 2014
Subjects:
Indium
Low temperature wafer bonding
MEMS
Scanning micromirror
Wafer level packaging
Online Access:http://scholarbank.nus.edu.sg/handle/10635/82147
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/82147

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