Wafer-level hermetic bonding using Sn/In and Cu/Ti/Au metallization

10.1109/TCAPT.2009.2016108

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Bibliographic Details
Main Authors:	Yu, D.-Q., Yan, L.L., Lee, C., Choi, W.K., Thew, S., Foo, C.K., Lau, J.H.
Other Authors:	ELECTRICAL & COMPUTER ENGINEERING
Format:	Article
Published:	2014
Subjects:	Hermeticity In-Sn Microelectromechanical systems (MEMS) Reliability Wafer bonding Wafer-level packaging
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/57791
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Institution:	National University of Singapore

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