Wafer-level hermetic bonding using Sn/In and Cu/Ti/Au metallization

Wafer-level hermetic bonding using Sn/In and Cu/Ti/Au metallization

10.1109/TCAPT.2009.2016108

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Bibliographic Details
Main Authors: Yu, D.-Q., Yan, L.L., Lee, C., Choi, W.K., Thew, S., Foo, C.K., Lau, J.H.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Article
Published: 2014
Subjects:
Hermeticity
In-Sn
Microelectromechanical systems (MEMS)
Reliability
Wafer bonding
Wafer-level packaging
Online Access:http://scholarbank.nus.edu.sg/handle/10635/57791
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Institution: National University of Singapore
id sg-nus-scholar.10635-57791
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spelling sg-nus-scholar.10635-577912023-10-31T20:14:54Z Wafer-level hermetic bonding using Sn/In and Cu/Ti/Au metallization Yu, D.-Q. Yan, L.L. Lee, C. Choi, W.K. Thew, S. Foo, C.K. Lau, J.H. ELECTRICAL & COMPUTER ENGINEERING Hermeticity In-Sn Microelectromechanical systems (MEMS) Reliability Wafer bonding Wafer-level packaging 10.1109/TCAPT.2009.2016108 IEEE Transactions on Components and Packaging Technologies 32 4 926-934 ITCPF 2014-06-17T03:10:14Z 2014-06-17T03:10:14Z 2009-12 Article Yu, D.-Q., Yan, L.L., Lee, C., Choi, W.K., Thew, S., Foo, C.K., Lau, J.H. (2009-12). Wafer-level hermetic bonding using Sn/In and Cu/Ti/Au metallization. IEEE Transactions on Components and Packaging Technologies 32 (4) : 926-934. ScholarBank@NUS Repository. https://doi.org/10.1109/TCAPT.2009.2016108 15213331 http://scholarbank.nus.edu.sg/handle/10635/57791 000272489400027 Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
topic Hermeticity
In-Sn
Microelectromechanical systems (MEMS)
Reliability
Wafer bonding
Wafer-level packaging
spellingShingle Hermeticity
In-Sn
Microelectromechanical systems (MEMS)
Reliability
Wafer bonding
Wafer-level packaging
Yu, D.-Q.
Yan, L.L.
Lee, C.
Choi, W.K.
Thew, S.
Foo, C.K.
Lau, J.H.
Wafer-level hermetic bonding using Sn/In and Cu/Ti/Au metallization
description 10.1109/TCAPT.2009.2016108
author2 ELECTRICAL & COMPUTER ENGINEERING
author_facet ELECTRICAL & COMPUTER ENGINEERING
Yu, D.-Q.
Yan, L.L.
Lee, C.
Choi, W.K.
Thew, S.
Foo, C.K.
Lau, J.H.
format Article
author Yu, D.-Q.
Yan, L.L.
Lee, C.
Choi, W.K.
Thew, S.
Foo, C.K.
Lau, J.H.
author_sort Yu, D.-Q.
title Wafer-level hermetic bonding using Sn/In and Cu/Ti/Au metallization
title_short Wafer-level hermetic bonding using Sn/In and Cu/Ti/Au metallization
title_full Wafer-level hermetic bonding using Sn/In and Cu/Ti/Au metallization
title_fullStr Wafer-level hermetic bonding using Sn/In and Cu/Ti/Au metallization
title_full_unstemmed Wafer-level hermetic bonding using Sn/In and Cu/Ti/Au metallization
title_sort wafer-level hermetic bonding using sn/in and cu/ti/au metallization
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/57791
_version_ 1781781474941337600

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