Characterization and reliability study of low temperature hermetic wafer level bonding using In/Sn interlayer and Cu/Ni/Au metallization

by Yu, D.-Q., Lee, C., Yan, L.L., Thew, M.L., Lau, J.H.
Published 2014

The role of Ni buffer layer on high yield low temperature hermetic wafer bonding using In/Sn/Cu metallization

by Yu, D.-Q., Lee, C., Yan, L.L., Choi, W.K., Yu, A., Lau, J.H.
Published 2014

Wafer-level hermetic bonding using Sn/In and Cu/Ti/Au metallization

by Yu, D.-Q., Yan, L.L., Lee, C., Choi, W.K., Thew, S., Foo, C.K., Lau, J.H.
Published 2014

A hermetic seal using composite thin-film In/Sn solder as an intermediate layer and its interdiffusion reaction with Cu

by Yan, L.-L., Lee, C.-K., Yu, D.-Q., Yu, A.-B., Choi, W.-K., Lau, J.-H., Yoon, S.-U.
Published 2014