Characterization and reliability study of low temperature hermetic wafer level bonding using In/Sn interlayer and Cu/Ni/Au metallization

by Yu, D.-Q., Lee, C., Yan, L.L., Thew, M.L., Lau, J.H.
Published 2014

Wafer level hermetic bonding using Sn/In and Cu/Ti/Au metallization

by Yu, D., Yan, L., Lee, C., Choi, W.K., Thew, M.L., Foo, C.K., Lau, J.H.
Published 2014