Wafer level hermetic bonding using Sn/In and Cu/Ti/Au metallization

Wafer level hermetic bonding using Sn/In and Cu/Ti/Au metallization

10.1109/EPTC.2008.4763525

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Bibliographic Details
Main Authors: Yu, D., Yan, L., Lee, C., Choi, W.K., Thew, M.L., Foo, C.K., Lau, J.H.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/72177
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/72177

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