Wafer level hermetic bonding using Sn/In and Cu/Ti/Au metallization
10.1109/EPTC.2008.4763525
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2014
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sg-nus-scholar.10635-721772015-01-13T12:46:20Z Wafer level hermetic bonding using Sn/In and Cu/Ti/Au metallization Yu, D. Yan, L. Lee, C. Choi, W.K. Thew, M.L. Foo, C.K. Lau, J.H. ELECTRICAL & COMPUTER ENGINEERING 10.1109/EPTC.2008.4763525 10th Electronics Packaging Technology Conference, EPTC 2008 767-772 2014-06-19T03:32:19Z 2014-06-19T03:32:19Z 2008 Conference Paper Yu, D.,Yan, L.,Lee, C.,Choi, W.K.,Thew, M.L.,Foo, C.K.,Lau, J.H. (2008). Wafer level hermetic bonding using Sn/In and Cu/Ti/Au metallization. 10th Electronics Packaging Technology Conference, EPTC 2008 : 767-772. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/EPTC.2008.4763525" target="_blank">https://doi.org/10.1109/EPTC.2008.4763525</a> 9781424421183 http://scholarbank.nus.edu.sg/handle/10635/72177 NOT_IN_WOS Scopus |
| institution |
National University of Singapore |
| building |
NUS Library |
| country |
Singapore |
| collection |
ScholarBank@NUS |
| description |
10.1109/EPTC.2008.4763525 |
| author2 |
ELECTRICAL & COMPUTER ENGINEERING |
| author_facet |
ELECTRICAL & COMPUTER ENGINEERING Yu, D. Yan, L. Lee, C. Choi, W.K. Thew, M.L. Foo, C.K. Lau, J.H. |
| format |
Conference or Workshop Item |
| author |
Yu, D. Yan, L. Lee, C. Choi, W.K. Thew, M.L. Foo, C.K. Lau, J.H. |
| spellingShingle |
Yu, D. Yan, L. Lee, C. Choi, W.K. Thew, M.L. Foo, C.K. Lau, J.H. Wafer level hermetic bonding using Sn/In and Cu/Ti/Au metallization |
| author_sort |
Yu, D. |
| title |
Wafer level hermetic bonding using Sn/In and Cu/Ti/Au metallization |
| title_short |
Wafer level hermetic bonding using Sn/In and Cu/Ti/Au metallization |
| title_full |
Wafer level hermetic bonding using Sn/In and Cu/Ti/Au metallization |
| title_fullStr |
Wafer level hermetic bonding using Sn/In and Cu/Ti/Au metallization |
| title_full_unstemmed |
Wafer level hermetic bonding using Sn/In and Cu/Ti/Au metallization |
| title_sort |
wafer level hermetic bonding using sn/in and cu/ti/au metallization |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/72177 |
| _version_ |
1681087518286544896 |