The role ofni buffer layer between insn solder and eu metallization for hermetic wafer bonding

بواسطة Yu, D., Lee, C., Lau, J.H.
منشور في 2014

Prevalence and factors associated with smoking among medical students in a local university

بواسطة Gyanchand Rampal, Lekhraj Rampal, David, N. C. E., Lau, J. H.
منشور في 2006

A rare complication of middle ear cholesteatoma - Pseudoaneurysm of petrous internal carotid artery

بواسطة Lim, L. Y., Mohamad, Irfan, Lau, J. H, Tang, I. P.
منشور في 2017

Bonding interface materials evolution of intermediate In/Ag layers for low temperature fluxless solder based MEMS wafer level packaging

بواسطة Lee, C., Yu, D., Yu, A., Yan, L., Wang, H., Lau, J.H.
منشور في 2014

Characterization and reliability study of low temperature hermetic wafer level bonding using In/Sn interlayer and Cu/Ni/Au metallization

بواسطة Yu, D.-Q., Lee, C., Yan, L.L., Thew, M.L., Lau, J.H.
منشور في 2014

Design and modeling of nanophotonic beam structures as optical NEMS sensors

بواسطة Lee, C., Thillaigovindan, J., Yu, A., Radhakrishnan, R., Chen, C.-C., Chao, Y.-T., Lau, J.H.
منشور في 2014

The role of Ni buffer layer on high yield low temperature hermetic wafer bonding using In/Sn/Cu metallization

بواسطة Yu, D.-Q., Lee, C., Yan, L.L., Choi, W.K., Yu, A., Lau, J.H.
منشور في 2014

Development of wafer level packaged scanning micromirrors

بواسطة Yu, A., Lee, C., Yan, L.L., Zhang, Q.X., Yoon, S.U., Lau, J.H.
منشور في 2014

Characterization of intermediate In/Ag layers of low temperature fluxless solder based wafer bonding for MEMS packaging

بواسطة Lee, C., Yu, A., Yan, L., Wang, H., He, J.H., Zhang, Q.X., Lau, J.H.
منشور في 2014

A hermetic chip to chip bonding at low temperature with Cu/In/Sn/Cu joint

بواسطة Yan, L., Lee, C., Yu, D., Choi, W.K., Yu, A., Yoon, S.U., Lau, J.H.
منشور في 2014

Wafer-level hermetic bonding using Sn/In and Cu/Ti/Au metallization

بواسطة Yu, D.-Q., Yan, L.L., Lee, C., Choi, W.K., Thew, S., Foo, C.K., Lau, J.H.
منشور في 2014

Wafer level hermetic bonding using Sn/In and Cu/Ti/Au metallization

بواسطة Yu, D., Yan, L., Lee, C., Choi, W.K., Thew, M.L., Foo, C.K., Lau, J.H.
منشور في 2014

Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications

بواسطة Made, R.I., Gan, C.L., Yan, L.L., Yu, A., Yoon, S.W., Lau, J.H., Lee, C.
منشور في 2014

Study of Ag-In solder as low temperature wafer bonding intermediate layer

بواسطة Made, R.I., Gan, C.L., Lee, C., Yan, L.L., Yu, A., Yoon, S.W., Lau, J.H.
منشور في 2014

A hermetic seal using composite thin-film In/Sn solder as an intermediate layer and its interdiffusion reaction with Cu

بواسطة Yan, L.-L., Lee, C.-K., Yu, D.-Q., Yu, A.-B., Choi, W.-K., Lau, J.-H., Yoon, S.-U.
منشور في 2014

Integrated liquid cooling systems for 3-D stacked TSV modules

بواسطة Tang, G.Y., Tan, S.P., Khan, N., Pinjala, D., Lau, J.H., Yu, A.B., Vaidyanathan, K., Toh, K.C.
منشور في 2014

Development of low temperature bonding using in-based solders

بواسطة Choi, W.K., Yu, D., Lee, C., Yan, L., Yu, A., Yoon, S.W., Lau, J.H., Cho, M.G., Jo, Y.H., Lee, H.M.
منشور في 2014