Integrated liquid cooling systems for 3-D stacked TSV modules

Integrated liquid cooling systems for 3-D stacked TSV modules

10.1109/TCAPT.2009.2033039

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Bibliographic Details
Main Authors: Tang, G.Y., Tan, S.P., Khan, N., Pinjala, D., Lau, J.H., Yu, A.B., Vaidyanathan, K., Toh, K.C.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
3-D TSV module
Integrated cooling solution
Pressure drop
Thermal management
Online Access:http://scholarbank.nus.edu.sg/handle/10635/60565
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/60565

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