Integrated liquid cooling systems for 3-D stacked TSV modules

• Main Authors: Tang, G.Y., Tan, S.P., Khan, N., Pinjala, D., Lau, J.H., Yu, A.B., Vaidyanathan, K., Toh, K.C.
• Other Authors: MECHANICAL ENGINEERING
• Format: Article
• Published: 2014
• Subjects: 3-D TSV module; Integrated cooling solution; Pressure drop; Thermal management
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/60565
• Institution: National University of Singapore

10.1109/TCAPT.2009.2033039