Analytical solutions for interconnect stress in board level drop impact

Analytical solutions for interconnect stress in board level drop impact

10.1109/TADVP.2007.898599

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Bibliographic Details
Main Authors: Wong, E.H., Mai, Y.-W., Seah, S.K.W., Lim, K.-M., Lim, T.B.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Analytical solutions
Drop impact
Electronic packaging
Electronics packaging
Integrated circuit manufacture
Mechanical shocks
Stress analysis
Online Access:http://scholarbank.nus.edu.sg/handle/10635/59537
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/59537

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