Frequency-dependent low cycle fatigue of Sn1Ag0.1Cu(In/Ni) solder joints subjected to high-frequency loading

by Wong, E.H., Seah, S.K.W., Shim, V.P.W.
Published 2016

Fatigue crack propagation behavior of lead-free solder joints under high-strain-rate cyclic loading

by Seah, S.K.W., Wong, E.H., Shim, V.P.W.
Published 2014

A review of board level solder joints for mobile applications

by Wong, E.H., Seah, S.K.W., Shim, V.P.W.
Published 2014

Study of microvia failure under PCB flexing loads

by Seah, S.K.W., Lim, C.T., Tan, V.B.C., Quah, S.E.
Published 2014

Failure mechanisms of interconnections in drop impact

by Seah, S.K.W., Wong, E.H., Mai, Y.W., Rajoo, R., Lim, C.T.
Published 2014

High-speed bend test method and failure prediction for drop impact reliability

by Seah, S.K.W., Wong, E.H., Mai, Y.W., Rajoo, R., Lim, C.T.
Published 2014

Understanding and testing for drop impact failure

by Seah, S.K.W., Wong, E.H., Ranjan, R., Lim, C.T., Mai, Y.-W.
Published 2014

Drop impact survey of portable electronic products

by Lim, C.T., Ang, C.W., Tan, L.B., Seah, S.K.W., Wong, E.H.
Published 2014

Analytical solutions for interconnect stress in board level drop impact

by Wong, E.H., Mai, Y.-W., Seah, S.K.W., Lim, K.M., Lim, T.B.
Published 2014

Analytical solutions for interconnect stress in board level drop impact

by Wong, E.H., Mai, Y.-W., Seah, S.K.W., Lim, K.-M., Lim, T.B.
Published 2014

Drop impact: Fundamentals & impact characterisation of solder joints

by Wong, E.H., Rajoo, R., Mai, Y.W., Seah, S.K.W., Tsai, K.T., Yap, L.M.
Published 2014

Drop impact reliability - A comprehensive summary

by Wong, E.H., Mai, Y.-W., Seah, S.K.W., Rajoo, R., Lim, T.B., Lim, C.T., Field, J.
Published 2014

Super stretched solder interconnects for wafer level packaging

by Rajoo, R., Wong, E.H., Lim, S.S., Hnin, W.Y., Seah, S.K.W., Tay, A.A.O., Iyer, M., Tummala, R.R.
Published 2014

Tackling the drop impact reliability of electronic packaging

by Wong, E.H., Lim, C.T., Field, J.E., Tan, V.B.C., Shim, V.P.W., Lim, K.M., Seah, S.K.W.
Published 2014

Development of stretch solder interconnections for wafer level packaging

by Rajoo, R., Lim, S.S., Wong, E.H., Hnin, W.Y., Seah, S.K.W., Tay, A.A.O., Iyer, M., Tummala, R.R.
Published 2014