Tackling the drop impact reliability of electronic packaging

Advances in Electronic Packaging

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Bibliographic Details
Main Authors: Wong, E.H., Lim, C.T., Field, J.E., Tan, V.B.C., Shim, V.P.W., Lim, K.M., Seah, S.K.W.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73913
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Institution: National University of Singapore