Tackling the drop impact reliability of electronic packaging

Advances in Electronic Packaging

Saved in:

Bibliographic Details
Main Authors:	Wong, E.H., Lim, C.T., Field, J.E., Tan, V.B.C., Shim, V.P.W., Lim, K.M., Seah, S.K.W.
Other Authors:	MECHANICAL ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/73913
Tags:	Add Tag No Tags, Be the first to tag this record!
Institution:	National University of Singapore

id	sg-nus-scholar.10635-73913
record_format	dspace
spelling	sg-nus-scholar.10635-739132015-01-06T12:06:52Z Tackling the drop impact reliability of electronic packaging Wong, E.H. Lim, C.T. Field, J.E. Tan, V.B.C. Shim, V.P.W. Lim, K.M. Seah, S.K.W. MECHANICAL ENGINEERING Advances in Electronic Packaging 1 757-763 2014-06-19T05:40:53Z 2014-06-19T05:40:53Z 2003 Conference Paper Wong, E.H.,Lim, C.T.,Field, J.E.,Tan, V.B.C.,Shim, V.P.W.,Lim, K.M.,Seah, S.K.W. (2003). Tackling the drop impact reliability of electronic packaging. Advances in Electronic Packaging 1 : 757-763. ScholarBank@NUS Repository. 0791836908 http://scholarbank.nus.edu.sg/handle/10635/73913 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
description	Advances in Electronic Packaging
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Wong, E.H. Lim, C.T. Field, J.E. Tan, V.B.C. Shim, V.P.W. Lim, K.M. Seah, S.K.W.
format	Conference or Workshop Item
author	Wong, E.H. Lim, C.T. Field, J.E. Tan, V.B.C. Shim, V.P.W. Lim, K.M. Seah, S.K.W.
spellingShingle	Wong, E.H. Lim, C.T. Field, J.E. Tan, V.B.C. Shim, V.P.W. Lim, K.M. Seah, S.K.W. Tackling the drop impact reliability of electronic packaging
author_sort	Wong, E.H.
title	Tackling the drop impact reliability of electronic packaging
title_short	Tackling the drop impact reliability of electronic packaging
title_full	Tackling the drop impact reliability of electronic packaging
title_fullStr	Tackling the drop impact reliability of electronic packaging
title_full_unstemmed	Tackling the drop impact reliability of electronic packaging
title_sort	tackling the drop impact reliability of electronic packaging
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/73913
_version_	1681087834294845440

Tackling the drop impact reliability of electronic packaging

Similar Items