Dynamic Mechanical Properties and Microstructural Studies of Lead-Free Solders in Electronic Packaging

by Tan, V.B.C., Ong, K.C., Lim, C.T., Field, J.E.
Published 2016

Tackling the drop impact reliability of electronic packaging

by Wong, E.H., Lim, C.T., Field, J.E., Tan, V.B.C., Shim, V.P.W., Lim, K.M., Seah, S.K.W.
Published 2014