Tackling the drop impact reliability of electronic packaging

• Main Authors: Wong, E.H., Lim, C.T., Field, J.E., Tan, V.B.C., Shim, V.P.W., Lim, K.M., Seah, S.K.W.
• Other Authors: MECHANICAL ENGINEERING
• Format: Conference or Workshop Item
• Published: 2014
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/73913
• Institution: National University of Singapore

Advances in Electronic Packaging