Advances in vapor pressure modeling for electronic packaging

Advances in vapor pressure modeling for electronic packaging

10.1109/TADVP.2006.879423

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Bibliographic Details
Main Authors: Wong, E.H., Koh, S.W., Lee, K.H., Lim, K.-M., Lim, T.B., Mai, Y.-W.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Moisture
Popcorn
Reflow
Vapor pressure
Wetness
Online Access:http://scholarbank.nus.edu.sg/handle/10635/59392
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/59392

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