Advances in vapor pressure modeling for electronic packaging

10.1109/TADVP.2006.879423

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Bibliographic Details
Main Authors:	Wong, E.H., Koh, S.W., Lee, K.H., Lim, K.-M., Lim, T.B., Mai, Y.-W.
Other Authors:	MECHANICAL ENGINEERING
Format:	Article
Published:	2014
Subjects:	Moisture Popcorn Reflow Vapor pressure Wetness
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/59392
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Institution:	National University of Singapore

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