SIMULATION AND CHARACTERIZATION ON MOISTURE SENSITIVITY PERFORMANCE FOR ELECTRONIC PACKAGES

SIMULATION AND CHARACTERIZATION ON MOISTURE SENSITIVITY PERFORMANCE FOR ELECTRONIC PACKAGES

Master's

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Bibliographic Details
Main Author: CHIN CHIAM CHUANG
Other Authors: SINGAPORE-MIT ALLIANCE
Format: Theses and Dissertations
Published: 2019
Subjects:
moisture diffusivity
saturated moisture concentration
coefficient of moisture expansion
hygroscopic swelling
thermal expansion
vapor pressure
interface delamination
Online Access:https://scholarbank.nus.edu.sg/handle/10635/154028
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Institution: National University of Singapore

Internet

https://scholarbank.nus.edu.sg/handle/10635/154028

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