Vapor pressure assisted interface delamination and failure of plastic IC packages - A micromechanics approach

Vapor pressure assisted interface delamination and failure of plastic IC packages - A micromechanics approach

Advances in Electronic Packaging

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Bibliographic Details
Main Authors: Chong, C.W., Guo, T.F., Cheng, L.
Other Authors: MATERIALS SCIENCE
Format: Conference or Workshop Item
Published: 2014
Subjects:
Computational cell elements
Interface delamination
Moisture sensitivity test
Moisture-induced damage
Void Growth
Online Access:http://scholarbank.nus.edu.sg/handle/10635/74001
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/74001

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