Thermomechanical analysis of plastic ball grid arrays with vapor pressure effects

Thermomechanical analysis of plastic ball grid arrays with vapor pressure effects

10.1109/TCAPT.2008.2004602

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Bibliographic Details
Main Authors: Cheong, W.G., Chew, H.B., Guo, T.F., Cheng, L.
Other Authors: MATERIALS SCIENCE AND ENGINEERING
Format: Article
Published: 2014
Subjects:
Finite-element analysis
Interfacial adhesion
Micromechanical damage
Moisture sensitivity
Package reliability
Online Access:http://scholarbank.nus.edu.sg/handle/10635/86807
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/86807

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