Thermomechanical analysis of plastic ball grid arrays with vapor pressure effects

• Main Authors: Cheong, W.G., Chew, H.B., Guo, T.F., Cheng, L.
• 其他作者: MECHANICAL ENGINEERING
• 格式: Article
• 出版: 2014
• 主題: Finite-element analysis; Interfacial adhesion; Micromechanical damage; Moisture sensitivity; Package reliability
• 在線閱讀: http://scholarbank.nus.edu.sg/handle/10635/86807
• 機構: National University of Singapore

10.1109/TCAPT.2008.2004602