FEA of thermal warpage in ball grid array with consideration of molding compound residual strain compared to experimental measurements

• Main Authors: Lim, Niño Rigo Emil G., Dimagiba, Richard, Ubando, Aristotle T., Gonzaga, Jeremias, Augusto, Gerardo L.
• Format: text
• Published: Animo Repository 2019
• Subjects: Ball grid array technology; Finite element method; Semiconductors—Packaging; Mechanical Engineering
• Online Access: https://animorepository.dlsu.edu.ph/faculty_research/2181; https://animorepository.dlsu.edu.ph/context/faculty_research/article/3180/type/native/viewcontent
• Institution: De La Salle University

As semiconductor devices continue to advance in terms of having smaller and denser designs, the semiconductor packages, in turn, must keep up with the changes to prevent the semiconductor chips from damages caused by internal and external factors. In this paper, a 3D finite element model was develop...