FEA of thermal warpage in ball grid array with consideration of molding compound residual strain compared to experimental measurements
As semiconductor devices continue to advance in terms of having smaller and denser designs, the semiconductor packages, in turn, must keep up with the changes to prevent the semiconductor chips from damages caused by internal and external factors. In this paper, a 3D finite element model was develop...
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| Main Authors: | , , , , |
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| Format: | text |
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Animo Repository
2019
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| Subjects: | |
| Online Access: | https://animorepository.dlsu.edu.ph/faculty_research/2181 https://animorepository.dlsu.edu.ph/context/faculty_research/article/3180/type/native/viewcontent |
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| Institution: | De La Salle University |