Automation of Ball Grid Array (BGA) intergrated circuit manufacturing line

• Main Author: Joseph Erasmo A. Galang
• Other Authors: Ho, Yeong Khing
• Format: Theses and Dissertations
• Published: 2008
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
• Online Access: http://hdl.handle.net/10356/4262
• Institution: Nanyang Technological University

This thesis is an example of how we can adopt a strategy to be cost competent in launching new Integrated Circuit (IC) packages in the market. On e is in an environment wherein the cost of manufacturing is far above and beyond many South East – Asian coutries especially in terms of manpower, materia...