Automation of Ball Grid Array (BGA) intergrated circuit manufacturing line

Automation of Ball Grid Array (BGA) intergrated circuit manufacturing line

This thesis is an example of how we can adopt a strategy to be cost competent in launching new Integrated Circuit (IC) packages in the market. On e is in an environment wherein the cost of manufacturing is far above and beyond many South East – Asian coutries especially in terms of manpower, materia...

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Main Author: Joseph Erasmo A. Galang
Other Authors: Ho, Yeong Khing
Format: Theses and Dissertations
Published: 2008
Subjects:
DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
Online Access:http://hdl.handle.net/10356/4262
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Institution: Nanyang Technological University
id sg-ntu-dr.10356-4262
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spelling sg-ntu-dr.10356-42622023-07-04T15:12:31Z Automation of Ball Grid Array (BGA) intergrated circuit manufacturing line Joseph Erasmo A. Galang Ho, Yeong Khing School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging This thesis is an example of how we can adopt a strategy to be cost competent in launching new Integrated Circuit (IC) packages in the market. On e is in an environment wherein the cost of manufacturing is far above and beyond many South East – Asian coutries especially in terms of manpower, material or cost of producing the product. Master of Science (Computer Control and Automation) 2008-09-17T09:47:56Z 2008-09-17T09:47:56Z 2003 2003 Thesis http://hdl.handle.net/10356/4262 Nanyang Technological University application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
topic DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
spellingShingle DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
Joseph Erasmo A. Galang
Automation of Ball Grid Array (BGA) intergrated circuit manufacturing line
description This thesis is an example of how we can adopt a strategy to be cost competent in launching new Integrated Circuit (IC) packages in the market. On e is in an environment wherein the cost of manufacturing is far above and beyond many South East – Asian coutries especially in terms of manpower, material or cost of producing the product.
author2 Ho, Yeong Khing
author_facet Ho, Yeong Khing
Joseph Erasmo A. Galang
format Theses and Dissertations
author Joseph Erasmo A. Galang
author_sort Joseph Erasmo A. Galang
title Automation of Ball Grid Array (BGA) intergrated circuit manufacturing line
title_short Automation of Ball Grid Array (BGA) intergrated circuit manufacturing line
title_full Automation of Ball Grid Array (BGA) intergrated circuit manufacturing line
title_fullStr Automation of Ball Grid Array (BGA) intergrated circuit manufacturing line
title_full_unstemmed Automation of Ball Grid Array (BGA) intergrated circuit manufacturing line
title_sort automation of ball grid array (bga) intergrated circuit manufacturing line
publishDate 2008
url http://hdl.handle.net/10356/4262
_version_ 1772828397304545280

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