Noise coupling analysis in integrated circuit packaging
The fast evolution of technology in electronics industry towards higher speed and density forces the integrated circuit (IC) packaging performance to its limits. A set of design rules for fine signal integrity (SI) performance in the integrated circuit is necessary due to the shorter transition time...
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| Format: | Final Year Project |
| Language: | English |
| Published: |
2015
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| Online Access: | http://hdl.handle.net/10356/62066 |
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| Institution: | Nanyang Technological University |
| Language: | English |