Electrical characterization of IC packages

• Main Author: Guruprasad B. G.
• Other Authors: Liu, Ai Qun
• Format: Theses and Dissertations
• Published: 2008
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
• Online Access: http://hdl.handle.net/10356/4325
• Institution: Nanyang Technological University

In this project, a PBGA package 3D lumped element model is developed and its parasitics are extracted using a FEM based solver. The package data is validated with a standard measurement procedure developed by JEDEC. This simulation methodology can be extended to other critical signals and packages,...