Electrical characterization of IC packages
In this project, a PBGA package 3D lumped element model is developed and its parasitics are extracted using a FEM based solver. The package data is validated with a standard measurement procedure developed by JEDEC. This simulation methodology can be extended to other critical signals and packages,...
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2008
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| Institution: | Nanyang Technological University |
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sg-ntu-dr.10356-43252023-07-04T15:43:12Z Electrical characterization of IC packages Guruprasad B. G. Liu, Ai Qun School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging In this project, a PBGA package 3D lumped element model is developed and its parasitics are extracted using a FEM based solver. The package data is validated with a standard measurement procedure developed by JEDEC. This simulation methodology can be extended to other critical signals and packages, and the parasitics can be extracted. Master of Science (Microelectronics) 2008-09-17T09:49:18Z 2008-09-17T09:49:18Z 2003 2003 Thesis http://hdl.handle.net/10356/4325 Nanyang Technological University application/pdf |
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Singapore Singapore |
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DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging |
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DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging Guruprasad B. G. Electrical characterization of IC packages |
| description |
In this project, a PBGA package 3D lumped element model is developed and its parasitics are extracted using a FEM based solver. The package data is validated with a standard measurement procedure developed by JEDEC. This simulation methodology can be extended to other critical signals and packages, and the parasitics can be extracted. |
| author2 |
Liu, Ai Qun |
| author_facet |
Liu, Ai Qun Guruprasad B. G. |
| format |
Theses and Dissertations |
| author |
Guruprasad B. G. |
| author_sort |
Guruprasad B. G. |
| title |
Electrical characterization of IC packages |
| title_short |
Electrical characterization of IC packages |
| title_full |
Electrical characterization of IC packages |
| title_fullStr |
Electrical characterization of IC packages |
| title_full_unstemmed |
Electrical characterization of IC packages |
| title_sort |
electrical characterization of ic packages |
| publishDate |
2008 |
| url |
http://hdl.handle.net/10356/4325 |
| _version_ |
1772826282975821824 |