Thermal stress analysis of electronic packaging components

• Main Author: See Toh, Chee Wai.
• Other Authors: Pang, John Hock Lye
• Format: Theses and Dissertations
• Language: English
• Published: 2008
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
• Online Access: http://hdl.handle.net/10356/13448
• Institution: Nanyang Technological University

The stress and strain behaviour of surface-mounted electronic packaging components under temperature cycling fatigue and creep deformations was investigated by non-linear three dimensional finite element method. In this research, solder joints of a PQFP package with a corner lead and solder joints o...